Progresses of Shearography: Key Technologies and Applications

被引：3
|
作者：
Wang Yonghong [1 ,2 ]
Yao Yanfeng [1 ]
Li Junrui [1 ,2 ]
Yan Peizheng [1 ,2 ]
Li Chen [1 ]
Wu Shuangle [1 ]
机构：
[1] Hefei Univ Technol, Sch Instrument Sci & Optoelect Engn, Hefei 230009, Peoples R China
[2] Hefei Univ Technol, Anhui Prov Key Lab Measuring Theory & Precis Inst, Hefei 230009, Anhui, Peoples R China
来源：
LASER & OPTOELECTRONICS PROGRESS | 2022年 / 59卷 / 14期
关键词：
nondestructive testing; shearography; spatial phase-shifting; multi-directional shearing; SPECKLE PATTERN INTERFEROMETRY; SHEARING INTERFEROMETER; DEFECTS; DISPLACEMENT; DEFORMATION; PLATES; FIELD; TIRE;
D O I：
10.3788/LOP202259.1415004
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Digital shearing speckle pattern interferometry (DSSPI), also named shearography, is an extensively researched non-contact high-sensitivity optical measurement method. The recent development of shearography, ranging from key technologies to applications is presented in detail within this paper. The new technologies of shearography, such as spatial phase-shifting shear interferometry, multi-directional shear interferometry, and multi-functional multiplex measurement, are described in detail, and their applications in nondestructive testing in aerospace, automobile, machinery, new materials, and other fields are introduced. At the end of the article, the pros and cons of shearography are analyzed, and the potential research content is discussed.
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页数：9
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