Study of EMC for Cu Bonding Wire Application

被引：1
|
作者：
Takeda, Toshiro [1 ]
Seki, Hidetoshi [1 ]
Itoh, Shingo [1 ]
Zenbutsu, Shin-ichi [1 ]
机构：
[1] Sumitomo Bakelite Co Ltd, Elect Device Mat Res Lab 1, Utsunomiya, Tochigi 3213231, Japan
来源：
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011) | 2011年 / 34卷 / 01期
关键词：
D O I：
10.1149/1.3567680
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temperature & Humidity Stress Test). Al elution and Cl ion was observed at the intermetallic layer. EMC with lower Cl ion content and Al inhibitor of corrosion shows better HAST property. The selection of frame retardant for green EMC is important because some retardants have a negative impact on HAST performance.
引用
收藏
页码：825 / 829
页数：5
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