A method for tightly coupled thermal-electrical simulation

被引：6
|
作者：
Klaassen, B
机构：
[1] GMD-SET Institute
来源：
MICROELECTRONICS JOURNAL | 1997年 / 28卷 / 03期
关键词：
D O I：
10.1016/S0026-2692(96)00028-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A method is presented to combine analogue simulators (like SPICE) with device simulators (like ANSYS), for thermal-electrical analysis of integrated circuits or systems. A sketch of a first prototype program is given together with the theoretical background, which makes use of convergence principles from waveform relaxation. It follows a short review of related work. Our approach can also be extended to more general problems occurring in microsystems simulation. (C) 1997 Elsevier Science Ltd.
引用
收藏
页码：239 / 245
页数：7
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