Laser structuring as an enabling technology for HDI and PSGA

被引：0
|
作者：
Higgins, LM [1 ]
Schreiner, AF [1 ]
机构：
[1] Siemens Semicond Mfg Syst, Austin, TX USA
来源：
FIFTH ANNUAL PAN PACIFIC MICROELECTRONICS SYMPOSIUM, PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：23 / 32
页数：10
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