Reliability, Thermal, and Power Modeling and Optimization

被引：0
|
作者：
Dick, Robert P. [1 ]
机构：
[1] Univ Michigan, Dept EECS, Ann Arbor, MI 48109 USA
来源：
2010 IEEE AND ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD) | 2010年
关键词：
LIFETIME RELIABILITY; MICROELECTRONICS;
D O I：
10.1109/ICCAD.2010.5654140
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
This tutorial provides an overview of challenges to designing and implementing reliable integrated circuits and systems, and suggests areas for future study. It illustrates some concepts in detail, explaining the challenges of appropriately considering the impact of temperature on reliability in fault-tolerant systems. Finally, it points out considerations that may influence adoption of reliability modeling and optimization techniques and stresses the importance of considering the most relevant fault processes during reliability modeling and optimization.
引用
收藏
页码：181 / 184
页数：4
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