Effect of Working Conditions on Bulk Resistance of Micro-channel Plate

被引：0
|
作者：
Huang, Yonggang [1 ]
Jiao, Peng [1 ]
Shi, Pan [1 ]
Wang, Yun [1 ]
Zhou, You [1 ]
Fu, Yang [1 ]
Wang, Jiuwang [1 ]
Jia, Jinsheng [1 ]
机构：
[1] China Bldg Mat Acad, Inst Special Glass Fiber & Photoelect Funct Mat, Beijing 100024, Peoples R China
来源：
AOPC 2019: OPTICAL SENSING AND IMAGING TECHNOLOGY | 2019年 / 11338卷
关键词：
Micro-channel plate (MCP); bulk resistance; tunneling conduction mechanism; working conditions; SURFACE CONDUCTIVITY; LEAD;
D O I：
10.1117/12.2543915
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
Micro-channel plate is an electronic multiplier element with two-dimensional hollow glass tube array structure, which has been widely used in low-light-level night vision imaging, particle detection and other devices. Bulk resistance of micro-channel plate is an important performance index, which affects the electronic multiplication performance, dynamic response range and time resolution of micro-channel plate. There are many literatures about the influence of the preparation process of microchannel plate on bulk resistance, but few reports about the influence of the working conditions of microchannel plate on bulk resistance. In this paper, we mainly study the influence of micro-channel plate voltage and ambient temperature on bulk resistance, and analyze the mechanism of the change by tunneling. The results show that: 1) The change of working conditions leads to the change of the bulk resistance of the micro-channel plate. The higher the temperature and the voltage of the micro-channel plate, the lower the bulk resistance of micro-channel plate. The larger the original bulk resistance, the smaller the change rate of the micro-channel plate is. 2) The phenomenon that the resistance of micro-channel plate varies with the use conditions conforms to the mechanism of tunneling conduction.
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页数：7
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