Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

被引：170

作者：

Liu, Duixian ^{[1
]}

Gu, Xiaoxiong ^{[1
]}

Baks, Christian W. ^{[1
]}

Valdes-Garcia, Alberto ^{[2
]}

机构：

[1] IBM TJ Watson Ctr, Yorktown Hts, NY 10583 USA

[2] IBM TJ Watson Ctr, RE Circuits & Syst Grp, Yorktown Hts, NY 10583 USA

来源：

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 2017年 / 65卷 / 12期

关键词：

Antenna cavities; antenna-in-package (AiP); dual-polarized patch antennas; feed line transitions; high-density integration; phased-array; radio frequency integrated circuit (RFIC) package; PATCH ANTENNAS; CELLULAR COMMUNICATIONS; TECHNOLOGY; RADIATION; ARRAYS; LTCC;

D O I：

10.1109/TAP.2017.2722873

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Phased-array modules at frequencies >20 GHz are expected to play an important role for 5G applications. Antennain-package (AiP) is a reliable and cost-effective method to realize these phased arrays. This paper introduces a practical Ka-band AiP structure and discusses the antenna element design and implementation tradeoffs. The AiP design is based on multilayer organic buildup substrates that are suitable for phased-array module integration needs and supports both horizontal and vertical polarizations. Measurement results from the fabricated antenna prototypes show 0.8 GHz return loss bandwidth and 3.8-dBi peak gain at 30.5 GHz. Simulation results agree with the measured ones.

引用

页码：6372 / 6379

页数：8

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