Failure Localization on the Open Circuit for a High Density Ceramic Flip-Chip Package after Reliability Test

Ceramic is widely used in high reliability microelectronic packaging as its excellent properties. Generally, failure analysis for ceramic flip-chip structure is more difficult than other traditional types considering its special structure. Interconnection open failures of a flip-chip device in reliability testing were studied, and a test scheme from NDE to DPA was developed. The possibility of internal failure of the substrate was eliminated through TDR test. The failure position was preliminarily determined by X-ray, SAM and optical microanalysis. And finally, the nickel layer was found to be the accurate failure position of the device which was realized through SEM&EDS. The failure analysis method can be used for reference for failure detection and analysis of other ceramic flip-chip packages.