A review on epoxy-based electrically conductive adhesives

被引:128
|
作者
Aradhana, Ruchi [1 ]
Mohanty, Smita [1 ,2 ]
Nayak, Sanjay Kumar [1 ,2 ]
机构
[1] CIPET, TVK Ind Estate, Chennai 600032, Tamil Nadu, India
[2] CIPET, LARPM, Bhubaneswar, Odisha, India
关键词
Electrically conductive adhesives (ECAs); Epoxy resin; Conduction mechanism; Conductive fillers; Inherently conductive polymers; CARBON-NANOTUBE; MECHANICAL-PROPERTIES; CURE KINETICS; FUNCTIONALIZED GRAPHENE; DIELECTRIC-PROPERTIES; SILVER NANOPARTICLES; PHYSICAL-PROPERTIES; COMPOSITES; NANOCOMPOSITES; FILLER;
D O I
10.1016/j.ijadhadh.2020.102596
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging applications including die fitting, solderless interconnections, component renovation, display interconnections, and heat dissipation, etc. ECAs seize attention of scientific researchers as green and sustainable lead-free interconnection material over conventional solders owing to their eco-friendliness, processing capability at low temperature, fewer processing steps, negligible stress on a substrate, flexibility and stretchability, and cost-effectiveness. Various researchers worked in the area of epoxy based conductive adhesives mainly focusing on the categories, conduction mechanisms, applications of conductive adhesives along with various types of conductive fillers, inherent conductive polymers and future prospective of epoxy resin in the field of conductive adhesives is presented.
引用
收藏
页数:18
相关论文
共 50 条
  • [1] A review on epoxy-based electrically conductive adhesives
    Aradhana, Ruchi
    Mohanty, Smita
    Nayak, Sanjay Kumar
    International Journal of Adhesion and Adhesives, 2020, 99
  • [2] Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives
    Tan, FT
    Qiao, XL
    Chen, JG
    Wang, HS
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2006, 26 (06) : 406 - 413
  • [3] Conduction Path Development in Electrically Conductive Adhesives Composed of an Epoxy-based Binder
    Sakaniwa, Yoshiaki
    Iida, Masaki
    Tada, Yasunori
    Inoue, Masahiro
    2015 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2015, : 252 - 257
  • [4] Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review
    Singh, Amit Kumar
    Panda, Bishnu Prasad
    Mohanty, Smita
    Nayak, Sanjay Kumar
    Gupta, Manoj Kumar
    POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING, 2018, 57 (09) : 903 - 934
  • [5] Electrically Conductive Epoxy Adhesives
    Sancaktar, Erol
    Bai, Lan
    POLYMERS, 2011, 3 (01) : 427 - 466
  • [6] Microrobot-based Nanoindentation of an Epoxy-based Electrically Conductive Adhesive
    Mircea, Iulian
    Fatikow, Sergej
    Sill, Albert
    2007 7TH IEEE CONFERENCE ON NANOTECHNOLOGY, VOL 1-3, 2007, : 723 - 726
  • [7] Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder
    Inoue, Masahiro
    Muta, Hiroaki
    Maekawa, Takuji
    Yamanaka, Shinsuke
    Suganuma, Katsuaki
    2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 63 - +
  • [8] Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
    Gao, Hong
    Liu, Lan
    Luo, Yuan-fang
    Jia, De-min
    Wang, Feng
    Liu, Kong-hua
    INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS, 2011, 60 (06) : 409 - 427
  • [9] Influence of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives
    Xiong Nana
    Li Zhiling
    Xie Hui
    Zhao Yuzhen
    Wang Yuehui
    Li Jingze
    RARE METAL MATERIALS AND ENGINEERING, 2016, 45 (10) : 2524 - 2528
  • [10] Influence of Curing Procedures on the Flectrical Properties of Epoxy-Based Isotropic Conductive Adhesives
    Xiong, Nana
    Li, Zhiling
    Li, Jingze
    Xie, Hui
    Wang, Yuehui
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 373 - 377