共 50 条
- [1] Angular Color Uniformity Improvement for Phosphor-converted White Light-Emitting Diodes by Optimizing Remote Coating Phosphor Geometry 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1483 - 1486
- [2] Phosphor Thickness Effects on the Optical Performance of High Power Phosphor Converted Chip-on-Board Light-Emitting Diodes 2014 IEEE REGION 10 SYMPOSIUM, 2014, : 293 - 296
- [3] A Cylindrical Tuber Encapsulant Geometry for Enhancing Optical Performance of Chip-on-Board Packaging Light-Emitting Diodes IEEE PHOTONICS JOURNAL, 2016, 8 (03):
- [5] Research on Luminance Distributions of Chip-On-Board Light-Emitting Diodes CRYSTALS, 2019, 9 (12):
- [7] Encapsulant Thickness Options As a Factor to Impact Thermal Performance of Chip-on-Board (COB) Light Emitting Diodes 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 199 - 202
- [8] Fabrication of freeform lens based on ionic wind for Chip-on-Board light-emitting diodes 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2414 - 2418
- [9] Enhancing Angular Color Uniformity of White Light-Emitting Diodes by Cone-Type Phosphor Layer Geometry 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,