共 50 条
- [1] DIRECT OBSERVATION OF THE SOLIDIFICATION PHENOMENON OF A TIN-LEAD ALLOY TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1985, 26 (02): : 144 - 151
- [2] The computer simulation of tin-lead alloy electrodeposition process Zashchita Metallov, 1993, 29 (04): : 626 - 634
- [3] Studies on large undercooling and solidification of multistage atomized tin-lead alloy Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 1998, 8 (Suppl): : 86 - 89
- [5] COMPUTER-SIMULATION OF THE PROCESS OF ELECTRODEPOSITION OF A TIN-LEAD ALLOY PROTECTION OF METALS, 1993, 29 (04): : 509 - 515
- [7] SOLIDIFICATION OF UNDERCOOLED DILUTE TIN-LEAD ALLOYS METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1977, 8 (08): : 1291 - 1299
- [9] A quasi two-dimensional benchmark experiment for the solidification of a tin-lead binary alloy COMPTES RENDUS MECANIQUE, 2007, 335 (5-6): : 336 - 341
- [10] TIN AND TIN-LEAD ALLOY ELECTROPLATING IN THE ELECTRONICS INDUSTRY PLATING AND SURFACE FINISHING, 1987, 74 (09): : 59 - 59