Characterizing nitrogen implant effects on 0.17μm gate oxide thickness and charge-to-breakdown

被引:0
|
作者
Gupta, R [1 ]
Do Thanh, L [1 ]
Fuller, R [1 ]
Young, A [1 ]
Moser, B [1 ]
Ameen, M [1 ]
机构
[1] Infineon Technol Richmond, Sandston, VA 23150 USA
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, we characterize the effect of nitrogen implants on the charge-to-breakdown (Q(bd)) characteristics of a 0.17 mum DRAM device. The characterization data includes effect of nitrogen dose and beam currents on Qbd, the variation of nitrogen dose as measured by thermaprobe over a full cryopump lifecycle and the effect of such variation on the actual gate oxide thickness and uniformity. Sensitivities of thermaprobe and gate oxide thickness to nitrogen dose are derived from the resulting dose curves.
引用
收藏
页码:338 / 341
页数:4
相关论文
共 50 条
  • [1] Nitrided gate dielectrics and charge-to-breakdown test
    Dimitrijev, S
    Tanner, P
    Harrison, HB
    Sweatman, D
    RAPID THERMAL AND INTEGRATED PROCESSING V, 1996, 429 : 239 - 244
  • [2] Charge-to-breakdown characteristics of thin gate oxide and buried oxide on SIMOX SOI wafers
    Seo, JH
    Woo, JC
    Mendicino, M
    Vasudev, PK
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (01) : 375 - 378
  • [3] High current injected charge-to-breakdown characteristics of thin gate oxide on SIMOX SOI having different buried oxide thickness
    Seo, JH
    Woo, JC
    Mendicino, M
    Vausudev, PK
    PROCEEDINGS OF THE SEVENTH INTERNATIONAL SYMPOSIUM ON SILICON-ON-INSULATOR TECHNOLOGY AND DEVICES, 1996, 96 (03): : 330 - 338
  • [4] The influence of post annealing on oxide charge-to-breakdown in tungsten polycide gate technology
    Lee, B
    Kim, S
    Kim, J
    Om, J
    SOLID-STATE ELECTRONICS, 2000, 44 (01) : 189 - 192
  • [5] A Charge-to-Breakdown (QBD) Approach to SiC Gate Oxide Lifetime Extraction and Modeling
    Moens, P.
    Franchi, J.
    Lettens, J.
    De Schepper, L.
    Domeij, M.
    Allerstam, F.
    PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 78 - 81
  • [6] GATE OXIDE CHARGE-TO-BREAKDOWN CORRELATION TO MOSFET HOT-ELECTRON DEGRADATION
    DAVIS, M
    LAHRI, R
    IEEE ELECTRON DEVICE LETTERS, 1988, 9 (04) : 183 - 185
  • [7] Improvement of charge-to-breakdown distribution by fluorine incorporation into thin gate oxides
    Mitani, Y
    Satake, H
    Nakasaki, Y
    Toriumi, A
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (11) : 2221 - 2226
  • [8] Quantitative study of charge-to-breakdown of thin gate oxide for a p(+)-poly-Si metal oxide semiconductor capacitor
    Wang, LS
    Lin, MS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (02) : 698 - 704
  • [9] Polarity dependence of cumulative properties of charge-to-breakdown in very thin gate oxides
    Brozek, T
    Szyper, EC
    Viswanathan, CR
    SOLID-STATE ELECTRONICS, 1997, 41 (07) : 995 - 999
  • [10] Effects of Nitrogen Implant on Ultra-Thin Gate Dielectric Breakdown
    Feng, Junhong
    Gan, Zhenghao
    Chang, Lifu
    2011 INTERNATIONAL CONFERENCE OF ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2011,