Contact Pressure Distribution of Chemical Mechanical Polishing Based on Bionic Polishing Pad

In order to improve the uniformity of the contact pressure distribution of chemical mechanical polishing, based on the Winkler foundation principle of mechanics and phyllotaxis theory of biology, a kind of stannum fixed abrasive pad with bionic surface texture has been designed, and the contact mechanism and ANSYS model have been established. By the calculating and analysis of contact pressure distribution on polishing wafer, the contact pressure distribution and the effects of the geometrical and physical parameters polishing pad on the contact pressure distributions have been obtained. The results show that the horizontal effect of the polishing pad is very small, the uniformity of contact pressure distribution can be improved, and there are the phyllotactic parameters which make the contact pressure distribution more uniformity.