An electroless copper plating method for Ti, Zr-based hydrogen storage alloys

被引:17
|
作者
Choi, SJ
Choi, J
Seo, CY
Park, CN [1 ]
机构
[1] Chonnam Natl Univ, Dept Mat Sci Engn, Kwangju 500757, South Korea
[2] Chonnam Natl Univ, Res Ctr High Qual Elect Components & Syst, Kwangju 500757, South Korea
[3] Hanlyo Univ, Dept Adv Mat Engn, Kwangyang, Chonnam, South Korea
[4] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea
关键词
metal hydrides; electrochemical reactions;
D O I
10.1016/S0925-8388(03)00247-0
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
An acidic electroless copper plating method using HF has been developed and applied to the hydrogen storage alloy: Zr-0.5 Ti-0.45 V-0.54 Ni-0.87 Cr-0.15 C0.21Mn0.4. It is shown that the copper plating mechanism is an ion-exchange process between alloy elements and copper ions. The resulting copper coating is metallic. The coated copper layer significantly improved activation properties of the alloy electrode for a Ni-MH secondary battery. Anodic polarization curves and SEM micrographs showed that the reason for this improvement is due to the dissolution of a surface oxide film by HF during the copper plating. This coating method was also successfully applied to eight other Zr(Ti) alloy powders with different compositions. It can be concluded that this electroless copper plating method can be widely applied to Ti(Zr)-based hydrogen storage alloys of various compositions which had been regarded to be difficult to coat by conventional electroless copper plating methods. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:725 / 729
页数:5
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