Not Whiskers or Hillocks, But Tin Bumps on RF Shielding Cans

被引：0
|
作者：
Varkey, Bijumon [1 ]
Christian, Bev [1 ]
Liu, Julie [1 ]
Romanov, Alexandre [1 ]
Moorhead, Philip [1 ]
机构：
[1] Res Mot Ltd, Engn Qual Assurance Grp, Waterloo, ON N2L 3L3, Canada
来源：
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 2010年 / 10卷 / 03期
关键词：
Design of Experiments (DOE) analysis; organic contaminates in plating bath; radio frequency (RF) shielding cans; reliability of metal plating process; surface mount technology (SMT); tin bumps;
D O I：
10.1109/TDMR.2010.2050772
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Pure tin bumps can sometimes be formed on tin-plated steel RF cans during certain conditions of reflow. This is a rare phenomena not associated with tin whiskers. A Design of Experiments (DOE) strategy was used to confirm the oven variables that could be used to turn the formation on or off. Extensive lab work and investigation by the supplier revealed that the root cause of these bumps is organic contamination during the plating process.
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页码：353 / 359
页数：7
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