Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder

被引:14
|
作者
Wan, Jingbo [1 ]
Liu, Yongchang [1 ]
Wei, Chen [1 ]
Gao, Zhiming [1 ]
机构
[1] Tianjin Univ, Coll Mat Sci & Engn, Minist Educ, Engn Res Ctr Shape Memory Mat, Tianjin 300072, Peoples R China
基金
中国国家自然科学基金;
关键词
metals; intermetallics; scanning and transmission electron microscopy; X-ray diffraction;
D O I
10.1016/j.jallcom.2007.09.070
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The effect of addition of In, up to 1 wt.%, on the formation of intermetallic compounds (IMCs) in the solidified Sn-3.7%Ag-0.9%Zn lead-free solder was investigated. As observed by microstructural analysis, the typical structure of Sn-Ag-Zn solder is composed of beta-Sn phase and mixed granules of Ag3Sn and AgZn IMCs. After alloying with In, it evolves into a mixture of randomly distributed rods and granules of AG(3)Sn and AgZn. Clearly, the addition of In into the explored Sn-Ag-Zn solder promotes the formation of rod-like IMCs for the reason that the growth competition of the Ag3Sn and AgZn IMCs was destroyed by the selective adsorption of In atoms on a certain preferable crystalline planes of the separated IMCs. The change in the morphology of the formed IMCs leads to a great difference in the mechanical performances, for example, the measured microhardness of the investigated solders evolves from 16.95 HV to 21.35 HV with the increase of In content. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:230 / 237
页数:8
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