Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

被引：238
|
作者：
Schubert, T. [1 ]
Ciupinski, L. [2 ]
Zielinski, W. [2 ]
Michalski, A. [2 ]
Weissgaeber, T. [1 ]
Kieback, B. [1 ]
机构：
[1] Fraunhofer Inst Mfg & Adv Mat, Dept Powder Met & Composite Mat, D-01277 Dresden, Germany
[2] Warsaw Univ Technol, Fac Mat Sci & Engn, PL-02507 Warsaw, Poland
来源：
SCRIPTA MATERIALIA | 2008年 / 58卷 / 04期
关键词：
diamond composite; thermal conductivity; interface structure;
D O I：
10.1016/j.scriptamat.2007.10.011
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：263 / 266
页数：4
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