Structure and low- temperature thermal relaxation of ion- implanted germanium

被引:2
|
作者
Glover, CJ [1 ]
Ridgway, MC
Yu, KM
Foran, GJ
Clerc, C
Hansen, JL
Nylandsted-Larsen, A
机构
[1] Australian Natl Univ, Res Sch Phys Sci & Engn, Canberra, ACT, Australia
[2] Univ Calif Berkeley, Lawrence Berkeley Lab, Div Mat Sci, Berkeley, CA 94720 USA
[3] Australian Nucl Sci & Technol Org, Menai, NSW 2234, Australia
[4] CNRS, F-91405 Orsay, France
[5] Univ Aarhus, Inst Phys & Astron, Aarhus, Denmark
关键词
extended X-ray absorption fine structure; spectroscopy; amorphous Germanium; ion implantation;
D O I
10.1107/S0909049500012620
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
The structure of implantation-induced damage in Ge has been investigated using high resolution extended X-ray absorption fine structure spectroscopy (EXAFS). EXAFS data analysis was performed with the Cumulant Method. For the crystalline-to-amorphous transformation, a progressive increase in bond-length was observed without the presence of an asymmetry in interatomic distance distribution (RDF). Beyond the amorphization threshold the RDF was dose dependent and asymmetric, where the bond-length and asymmetry increased as functions of ion dose. Such an effect was attributed to the formation of three- and five-fold coordinated atoms within the amorphous phase. Low-temperature thermal annealing resulted in structural relaxation of the amorphous phase as evidenced by a reduction in the centroid, asymmetry and width of the RDF, as consistent with a reduction in the fraction of non four-fold coordinated atoms. The results have been compared to other EXAFS studies of amorphous Ge, and it is suggested that the range of bond-lengths reported therein is related to the sample preparation method and state of relaxation.
引用
收藏
页码:773 / 775
页数:3
相关论文
共 50 条
  • [1] Comparison of low- and room-temperature damage formation in Ar ion implanted GaN and ZnO
    Wendler, E.
    Wesch, W.
    Azarov, A. Yu.
    Catarino, N.
    Redondo-Cubero, A.
    Alves, E.
    Lorenz, K.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2013, 307 : 394 - 398
  • [2] Formation of cellular defect structure on GaSb ion-implanted at low temperature
    Nitta, N
    Taniwaki, M
    Hayashi, Y
    Yoshiie, T
    JOURNAL OF APPLIED PHYSICS, 2002, 92 (04) : 1799 - 1802
  • [3] Low temperature exfoliation process in hydrogen-implanted germanium layers
    Ferain, I. P.
    Byun, K. Y.
    Colinge, C. A.
    Brightup, S.
    Goorsky, M. S.
    JOURNAL OF APPLIED PHYSICS, 2010, 107 (05)
  • [4] Influence of stress in epitaxial ferrite-garnet films on the processes of radiation defect formation and low-temperature aging of the ion- implanted layers
    Yaremiy, Ivan
    Ostafiychuk, Bogdan
    Fedoriv, Vasyl
    Yaremiy, Sofiya
    Povkh, Mariya
    MATERIALS TODAY-PROCEEDINGS, 2022, 62 : 5833 - 5837
  • [5] DIFFUSION OF DEFECTS IN LOW TEMPERATURE ION IMPLANTED GAAS
    GAMO, K
    AOKI, K
    MASUDA, K
    NAMBA, S
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1971, 10 (08) : 1118 - &
  • [6] Germanium substrate loss during low temperature annealing and its influence on ion-implanted phosphorous dose loss
    Ioannou, N.
    Skarlatos, D.
    Tsamis, C.
    Krontiras, C. A.
    Georga, S. N.
    Christofi, A.
    McPhail, D. S.
    APPLIED PHYSICS LETTERS, 2008, 93 (10)
  • [7] INVESTIGATIONS OF THE ELECTRON-STRUCTURE OF ION-IMPLANTED AMORPHOUS-GERMANIUM
    PETO, G
    KANSKI, J
    SODERVALL, U
    PHYSICS LETTERS A, 1987, 124 (09) : 510 - 514
  • [8] THERMAL OSCILLATIONS IN N-GERMANIUM AT LOW TEMPERATURE
    KOENIG, SH
    BROWN, RD
    JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1959, 10 (2-3) : 201 - 203
  • [9] Room temperature annealing of low-temperature ion implanted sapphire
    Schnohr, C. S.
    Wendler, E.
    Wesch, W.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2007, 257 : 492 - 495
  • [10] Temperature Dependence of Thermal Conductivity for Low-κ Dielectric Materials
    Ji, Chaoyue
    Wang, Shizhao
    Cai, Xintian
    Wang, Zhen
    Liu, Sheng
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,