Selective Plasma Etching of Polymeric Substrates for Advanced Applications

被引:100
|
作者
Puliyalil, Harinarayanan [1 ,2 ]
Cvelbar, Uros [1 ,2 ]
机构
[1] Jozef Stefan Int Postgrad Sch, Jamova Cesta 39, Ljubljana 1000, Slovenia
[2] Jozef Stefan Inst, Jamova Cesta 39, Ljubljana 1000, Slovenia
关键词
plasma etching; selectivity; surface chemistry; nanomesh; nanostructuring; polymer composite; biomaterials; adhesion; etch mask; radical atoms; OXYGEN PLASMA; CARBON NANOTUBES; SURFACE MODIFICATION; GRAPHENE NANOMESH; LARGE-AREA; ENHANCED ADHESION; BLOOD-PLASMA; THIN-FILMS; FABRICATION; SEPARATION;
D O I
10.3390/nano6060108
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
In today's nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interactions with precise bonds in materials and later cause etching. This typically occurs based on material stability, which leads to preferential etching of one material over other. This process is especially interesting for polymeric substrates with increasing complexity and a "zoo" of bonds, which are used in numerous applications. In this comprehensive summary, we encompass the complete selective etching of polymers and polymer matrix micro-/nanocomposites with plasma and unravel the mechanisms behind the scenes, which ultimately leads to the enhancement of surface properties and device performance.
引用
收藏
页数:24
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