共 3 条
- [1] Advances in materials for optoelectronic, microelectronic and Moems/Mems packaging EIGHTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2002, 2002, : 30 - 34
- [2] Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 2029 - 2035
- [3] Service life prediction of polymeric materials: Quantitative characterization and linkage of field and laboratory exposure environments. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2003, 226 : U476 - U476