Carboxylated Carbon Nanotube/Polyimide Films with Low Thermal Expansion Coefficient and Excellent Mechanical Properties

被引:15
|
作者
Lu, Cheng [1 ,2 ]
Lin, Fangbing [2 ]
Shao, Huiqi [2 ,3 ]
Bi, Siyi [1 ,2 ]
Chen, Nanliang [1 ,2 ]
Shao, Guangwei [1 ,2 ]
Jiang, Jinhua [1 ,2 ]
机构
[1] Donghua Univ, Coll Text, Shanghai Frontier Sci Res Ctr Modern Text, Shanghai 201620, Peoples R China
[2] Donghua Univ, Engn Res Ctr Syst Text, Minist Educ, Shanghai 201620, Peoples R China
[3] Donghua Univ, Innovat Ctr Text Sci & Technol, Shanghai 200051, Peoples R China
基金
上海市自然科学基金;
关键词
multiwalled carbon nanotubes; acid treatment; polyimide film; physical-chemical properties; ELECTROCHEMICAL PROPERTIES; COMPOSITE FIBERS; CYANINE DYE; NANOTUBES; POLYIMIDE; FUNCTIONALIZATION; PHOTOLUMINESCENCE; POLYMERIZATION; SENSITIVITY; NANOFIBERS;
D O I
10.3390/polym14214565
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Polyimide (PI) films with excellent heat resistance and outstanding mechanical properties have been widely researched in microelectronics and aerospace fields. However, most PI films can only be used under ordinary conditions due to their instability of dimension. The fabrication of multifunctional PI films for harsh conditions is still a challenge. Herein, flexible, low coefficient of thermal expansion (CTE) and improved mechanical properties films modified by carboxylated carbon nanotube (C-CNT) were fabricated. Acid treatment was adapted to adjust the surface characteristics by using a mixture of concentrated H2SO4/HNO3 solution to introduce carboxyl groups on the surface and improve the interfacial performance between the CNT and matrix. Moreover, different C-CNT concentrations of 0, 1, 3, 5, 7, and 9 wt.% were synthesized to use for the PI film fabrication. The results demonstrated that the 9 wt.% and 5 wt.% C-CNT/PI films possessed the lowest CTE value and the highest mechanical properties. In addition, the thermal stability of the C-CNT/PI films was improved, making them promising applications in precise and harsh environments.
引用
收藏
页数:17
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