Thermo-physical properties of Sip/LD11 composites for electronic packaging

The Si-p/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Si-p/LD11 are decreased. The CTEs of Si-p/ LD11 can be adjusted between 8.3 X 10(-6) - 12 X 10(-6)/degrees C, and the thermal conductivity is larger than 87.7 W/ (m - degrees C). This meets the requirements of electronic packaging material. The CTEs of Si-p/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTES of Si-p/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.