Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs

被引：62
|
作者：
Li, Hong [1 ]
Xu, Chuan [1 ]
Banerjee, Kaustav [1 ]
机构：
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
来源：
IEEE DESIGN & TEST OF COMPUTERS | 2010年 / 27卷 / 04期
基金：
美国国家科学基金会;
关键词：
NANOTUBES;
D O I：
10.1109/MDT.2010.55
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Editor's note:Carbon nanotubes and graphene nanoribbons are two promising next-generation interconnect technologies. Electrical modeling and performance analysis have demonstrated the superiority of these emerging technologies compared to conventional copper interconnects, as this article explains. Sriram Vangal, Intel © 2010 IEEE.
引用
收藏
页码：20 / 31
页数：12
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