Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide

被引：7
|
作者：
Yuba, Tomoyuki [1 ]
Okuda, Ryoji [1 ]
Tomikawa, Masao [1 ]
Kim, Jae Hyun [2 ]
机构：
[1] Toray Industries Ltd, Elect & Imaging Mat Res Labs, Shiga 5200842, Japan
[2] SAMSUNG ELECT CO LTD, Mfg Technol Team, Infra Technol Serv Ctr, Device Solut Business, Hwasung City 445701, Gyeonggi Do, South Korea
来源：
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2010年 / 23卷 / 06期
关键词：
Photosensitivity; PAC decomposition; residual solvent; development loss; POLY(AMIC ACID);
D O I：
10.2494/photopolymer.23.775
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazonaphthoquinone sulfonate. After soft baking, 10-14% of solvent was remained. Below 120 degrees C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130 degrees C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120 degrees C for 4min is suitable soft baking condition in this study.
引用
收藏
页码：775 / 779
页数：5
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