Room temperature screening of thermal conductivity by means of thermal transient measurements

被引:1
|
作者
Garcia-Canadas, Jorge [1 ,2 ]
Cheng, Shudan [1 ]
Marquez-Garcia, Lourdes [1 ]
Prest, Martin J. [1 ]
Akbari-Rahimabadi, Ahmad [1 ,3 ]
Min, Gao [1 ]
机构
[1] Cardiff Univ, Cardiff Sch Engn, Cardiff CF24 3AA, S Glam, Wales
[2] Univ Jaume 1, Dept Ind Syst Engn & Design, Campus Riu Sec, Castellon de La Plana 12071, Spain
[3] Islamic Azad Univ, Kermanshah Branch, Dept Mech Engn, Kermanshah, Iran
基金
欧盟第七框架计划;
关键词
thermal conductivity; high-throughput; thermoelectric; screening;
D O I
10.1088/0957-0233/27/10/105602
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A proof of concept of the possibility to estimate thermal conductivity of bulk disc samples at room temperature by means of thermal decays is demonstrated. An experimental set-up was designed and fabricated, which is able to perform thermal transient measurements by using a specially designed multifunctional probe that has the ability to measure temperature at its tip. Initially, the probe is heated by a heater coil located in its interior until the tip temperature reaches a steady state. Then, the probe is contacted with a disc sample which produces a temperature decay until a new state is reached. The difference between the initial and final states temperatures shows a correlation with the thermal conductivity of the sample. Employing a calibration equation, obtained using reference materials, the thermal conductivity can be calculated. Reasonably good random and systematic errors (<13% and similar to 9% respectively) are obtained. Theoretical simulations performed using COMSOL show a good qualitative agreement with experimental results. This new method involves an inexpensive and simple set-up which can be especially useful for thermal conductivity screening and high-throughput measurements.
引用
收藏
页数:6
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