Meeting industry needs with laser micromachining

被引：0

作者：

Held, A ^{[1
]}

Li, MW ^{[1
]}

机构：

[1] Spectra Phys, Mountain View, CA 94043 USA

来源：

SOLID STATE TECHNOLOGY | 2003年 / 46卷 / 10期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Laser micromachining is just beginning to be used in semiconductor manufacturing. Some of the more applicable areas are found in assembly and packaging. As the benefits become more apparent for this arena, laser processing will undoubtedly replace traditional mechanical and clinical techniques.

引用

页码：83 / +

页数：4

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