Fast thermal analysis of TSV-based 3D-ICs by GMRES with symmetric successive over-relaxation (SSOR) preconditioning

被引：0
|
作者：
Zhu, Jianping [1 ]
Liu, Yingying [2 ]
Zhuang, Wei [2 ]
Tang, Wanchun [2 ]
机构：
[1] Nanjing Univ Sci & Technol, Sch Elect & Opt Engn, Nanjing 210094, Jiangsu, Peoples R China
[2] Nanjing Normal Univ, Jiangsu Key Lab Optoelect Technol, Nanjing 210094, Jiangsu, Peoples R China
来源：
2015 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM | 2015年
关键词：
3D-ICs; finite difference method; SSOR; GMRES; thermal analysis; TSVs;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Thermal issue is a leading design constraint for three-dimensional integrated circuits (3D-ICs) and through silicon vias (TSVs) are used to reduce the temperature of 3D-ICs effectively. In this paper, the finite difference method-based heat conduction equations is proposed for the thermal analysis of the TSV structures in 3D-ICs and generalized minimum residual method (GMRES) with symmetric successive over-relaxation (SSOR) preconditioning is utilized to solve the resulting temperature matrix equations. Simulation results show the accuracy and efficiency of the proposed method.
引用
收藏
页码：178 / 181
页数：4
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