Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

被引：0
|
作者：
Beker, B [1 ]
Yee, I [1 ]
Miracky, R [1 ]
机构：
[1] Univ S Carolina, Dept Elect & Comp Engn, Columbia, SC 29208 USA
来源：
48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年
关键词：
D O I：
10.1109/ECTC.1998.678923
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes the modeling approach and numerical results of MCM transmission lines formed by periodic interwoven metallization patterns. The characteristic impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmission lines are pointed out and ample data are provided for the "weaved" line as a function of several geometrical parameters.
引用
收藏
页码：1379 / 1383
页数：5
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