Core logic simultaneous switching noise measurements on a 500MHz CMOS chip on a CBGA SCM

被引:2
|
作者
Singh, B [1 ]
Becker, WD [1 ]
McAllister, M [1 ]
机构
[1] IBM Corp, Poughkeepsie, NY 12601 USA
关键词
D O I
10.1109/ECTC.1998.678757
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper the effect of on-chip thin oxide decoupling capacitors on power supply noise due to internal logic switching will be presented.The effect of logic switching on power supply noise as function of, amount of capacitance, capacitance placement, voltage, temperature and frequency of operation will be characterized. Results of both measurements and simulations will be presented.
引用
收藏
页码:605 / 609
页数:5
相关论文
共 14 条
  • [1] A 500MHz 288kb CMOS SRAM macro for on-chip cache
    Furumochi, K
    Shimizu, H
    Fujita, M
    Akita, T
    Izawa, T
    Katsube, M
    Aoyama, K
    Kawamura, S
    1996 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS, 1996, 39 : 156 - 157
  • [2] Simultaneous switching, noise, and reliability analyses of VLSI core logic
    Hajj, Ibrahim N.
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 1999,
  • [3] Estimation of on-chip simultaneous switching noise in VDSM CMOS circuits
    Tang, KT
    Friedman, EG
    2000 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, TECHNICAL PROCEEDINGS, 2000, : 313 - 316
  • [4] Simultaneous switching noise in on-chip CMOS power distribution networks
    Tang, KT
    Friedman, EG
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2002, 10 (04) : 487 - 493
  • [5] A new low switching noise CMOS logic circuits for single-chip CMOS imaging system
    Chung, HH
    Rhee, J
    Joo, Y
    PROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2, 2003, : 1136 - 1140
  • [6] Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 μm CMOS test chip
    Budell, T
    Audet, J
    Kent, D
    Libous, J
    O'Connor, D
    Rosser, S
    Tremble, E
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1087 - 1094
  • [7] Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core
    Kim, Hyunwoo
    Choi, Seonguk
    Park, Joonsang
    Kim, Haeyeon
    Son, Kceyoung
    Lee, Junghyun
    Yoon, Jiwon
    Hong, Jonghyun
    Sim, Boogyo
    Kim, Keunwoo
    Shin, Tacit'
    Kim, Joungho
    2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS, 2023,
  • [8] A 500MHz 4Mb CMOS pipeline-burst cache SRAM with point-to-point noise reduction coding I/O
    Nakamura, K
    Takeda, K
    Toyoshima, H
    Noda, K
    Ohkubo, H
    Uchida, T
    Shimizu, T
    Itani, T
    Tokashiki, K
    Kishimoto, K
    1997 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE - DIGEST OF TECHNICAL PAPERS, 1997, 40 : 406 - 407
  • [9] Delay uncertainty due to on-chip simultaneous switching noise in high performance cmos integrated circuits
    Tang, KT
    Friedman, EG
    2000 IEEE WORKSHOP ON SIGNAL PROCESSING SYSTEMS: DESIGN AND IMPLEMENTATION, 2000, : 633 - 642
  • [10] Measurement, modeling, and simulation of flip-chip CMOS ASIC simultaneous switching noise on a multilayer ceramic BGA
    Libous, JP
    OConnor, DP
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (03): : 266 - 271