Nanoheteroepitaxy of GaN on AlN/Si(111) nanorods fabricated by nanosphere lithography

被引:3
|
作者
Lee, Donghyun [1 ]
Shin, In-Su [1 ]
Jin, Lu [2 ]
Kim, Donghyun [3 ]
Park, Yongjo [4 ]
Yoon, Euijoon [1 ,2 ,4 ]
机构
[1] Seoul Natl Univ, Dept Mat Sci & Engn, WCU Hybrid Mat Program, Seoul 151742, South Korea
[2] Seoul Natl Univ, Dept Mat Sci & Engn, Seoul 151742, South Korea
[3] Korea Adv Nano Fab Ctr, Suwon 443770, South Korea
[4] Seoul Natl Univ, Adv Inst Convergence Technol, Energy Semicond Res Ctr, Suwon 443270, South Korea
关键词
Nanostructures; Stresses; Si substrates; Metalorganic chemical vapor deposition; Nitrides; MISMATCHED SEMICONDUCTOR-MATERIALS; CHEMICAL-VAPOR-DEPOSITION; EPITAXIAL-GROWTH; SI(111); SI; STRESS; REDUCTION; SUBSTRATE; STRAIN; LAYERS;
D O I
10.1016/j.jcrysgro.2016.03.028
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Nanoheteroepitaxy (NHE) of GaN on an AlN/Si(111) nanorod structure was investigated by metal-organic chemical vapor deposition. Silica nanosphere lithography was employed to fabricate a periodic hexagonal nanorod array with a narrow gap of 30 nm between the nanorods. We were successful in obtaining a fully coalesced GaN film on the AlN/Si(111) nanorod structure. Transmission electron microscopy revealed that threading dislocation (TD) bending and termination by stacking faults occurred near the interface between GaN and the AlN/Si(111) nanorods, resulting in the reduction of TD density for the NHE GaN layer. The full width at half-maximum of the X-ray rocking curve for (102) plane of the NHE GaN was found to decrease down to 728 arcsec from 1005 arcsec for the GaN layer on a planar AlN/Si(111) substrate, indicating that the crystalline quality of the NHE GaN was improved. Also, micro-Raman measurement showed that tensile stress in the NHE GaN layer was reduced significantly as much as 70% by introducing air voids between the nanorods. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:9 / 13
页数:5
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