Normally-Off MOS-HFET on AlGaN/GaN-on-Si(110) Grown by NH3 MBE

被引:11
|
作者
Han, Sang-Woo [1 ]
Noh, Youngkyun [2 ,3 ]
Jo, Min-Gi [1 ]
Kim, Seung-Hwan [4 ]
Oh, Jae-Eung [2 ]
Seo, Kwang-Seok [5 ]
Cha, Ho-Young [1 ]
机构
[1] Hongik Univ, Sch Elect & Elect Engn, Seoul 04066, South Korea
[2] Hanyang Univ, Sch Elect Engn, Seoul 15588, South Korea
[3] IV Works Co Ltd, Daejeon 34056, South Korea
[4] Hongik Univ, Metamaterial Elect Device Res Ctr, Seoul 04066, South Korea
[5] Seoul Natl Univ, Dept Elect & Comp Engn, Seoul 08826, South Korea
基金
新加坡国家研究基金会;
关键词
Gallium nitride; molecular beam epitaxy; GaN-on-Si(110); metal-oxide-semiconductor-heterojunction field-effect transistor; normally-off; MOLECULAR-BEAM EPITAXY; GAN; SI(110); MOBILITY; LAYERS; CMOS; GATE; ALN;
D O I
10.1109/LED.2016.2621184
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Due to the difficulty of GaN epitaxy growth on Si(001) substrate, GaN-on-Si wafers are generally grown on Si(111) substrates. Because of the poor electrical characteristics of Si(111) orientation, monolithic integration between CMOS ICs and GaN devices cannot be implemented on GaN-on-Si(111) wafers. At this point of view, Si(110) substrate will be an alternative choice for GaN-on-Si epitaxy growth, because it has good atomic arrangement with AlN seed layer and an advantage of excellent hole mobility characteristics over Si(001). We have developed high quality GaN epitaxy growth technique on Si(110) substrate using NH3 MBE and demonstrated normally-off AlGaN/GaN-on-Si(110) metal-oxide-semiconductor-heterojunction field-effect transistors with an OFF-state breakdown voltage of 610 V. The fabricated device exhibited promising characteristics comparable with those achieved on conventional GaN-on-Si(111) wafers.
引用
收藏
页码:1613 / 1616
页数:4
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