Preparation and catalytic properties of single phase Ni-Sn intermetallic compound particles by CVD of Sn(CH3)4 onto Ni/silica

被引：19
|
作者：
Onda, A [1 ]
Komatsu, T [1 ]
Yashima, T [1 ]
机构：
[1] Tokyo Inst Technol, Dept Chem, Meguro Ku, Tokyo 152, Japan
来源：
CHEMICAL COMMUNICATIONS | 1998年 / 15期
关键词：
D O I：
10.1039/a803071e
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
Particles of each of the single phase Ni-Sn intermetallic compounds Ni3Sn, Ni3Sn2 and Ni3Sn4 have been formed on silica by chemical vapor deposition (CVD) of Sn(CH3)(4) onto Ni/SiO2 and used as catalysts for cyclohexane dehydrogenation.
引用
收藏
页码：1507 / 1508
页数：2
相关论文
共 35 条
  • [1] Preparation and catalytic properties of single-phase Ni-Sn intermetallic compound particles by CVD of Sn(CH3)4 onto Ni/silica
    Onda, A
    Komatsu, T
    Yashima, T
    JOURNAL OF CATALYSIS, 2001, 201 (01) : 13 - 21
  • [2] Characterization and catalytic properties of Ni-Sn intermetallic compounds in acetylene hydrogenation
    Onda, A
    Komatsu, T
    Yashima, T
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2000, 2 (13) : 2999 - 3005
  • [3] Characterizations and catalytic properties of fine particles of Ni-Sn intermetallic compounds supported on SiO2
    Onda, A
    Komatsu, T
    Yashima, T
    JOURNAL OF CATALYSIS, 2004, 221 (02) : 378 - 385
  • [4] The mechanical properties and elastic anisotropy of Ni3Sn4 intermetallic compound
    Wang, Jian
    Deng, Chuanjin
    Chen, Kaibin
    Deng, Rui
    Jiang, Kun
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [5] Analysis on the growth and growth-dependent microhardness of Ni3Sn4 intermetallic compound phase in directionally solidified Sn-Ni alloy
    Peng, Peng
    JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 821
  • [6] Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration
    Yang, Yi-Shan
    Yang, Chia-Jung
    Ouyang, Fan-Yi
    JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 674 : 331 - 340
  • [7] Research on Ni3Sn4 intermetallic compound for 5 μm diameter Cu/Ni/Sn-3.0Ag micro bumps
    Dai, Fengwei
    Zhang, David Wei
    Yan, Yangyang
    Wang, Guojun
    Cao, Liqiang
    IEICE ELECTRONICS EXPRESS, 2022, 19 (02):
  • [8] SYNTHESIS, STRUCTURE AND PROPERTIES OF A NEW INTERMETALLIC COMPOUND, CA7NI4SN13
    VENNOS, DA
    BADDING, ME
    DISALVO, FJ
    JOURNAL OF THE LESS-COMMON METALS, 1991, 175 (02): : 339 - 346
  • [9] Role of Plastic Behaviors of Ni3Sn4 Intermetallic Compound on Solder Joint Reliability
    Cheng, Hsien-Chie
    Hong, Ruei-You
    Hu, Hsuan-Chi
    Chen, Wen-Hwa
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2018, 18 (01) : 18 - 26
  • [10] Polar intermetallic compounds as catalysts for hydrogenation reactions:: Synthesis, structures, bonding, and catalytic properties of Ca1-xSrxNi4Sn2 (x=0.0, 0.5, 1.0) and catalytic properties of Ni3Sn and Ni3Sn2
    Hlukhyy, Viktor
    Raif, Fabian
    Claus, Peter
    Faessler, Thomas F.
    CHEMISTRY-A EUROPEAN JOURNAL, 2008, 14 (12) : 3737 - 3744
1234