Design and finite element simulation of mems for fatigue test

被引：0
|
作者：
De Pasquale, G. [1 ]
Soma, A. [1 ]
机构：
[1] Politecn Torino, Dept Mech, I-10129 Turin, Italy
来源：
CAS 2007 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2007年
关键词：
fatigue damage; stress; traction; shear; gold technology; interferometric microscope; THIN-FILMS; SILICON;
D O I：
10.1109/SMICND.2007.4519671
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Design and modelling of test structures for the analysis of fatigue damage occurring in oscillating microstructures is presented. F.E.M models are realized to optimize specimen shapes and electro-mechanical actuation parameters. Two different structural geometries are defined to realize both traction and shear tensile specimen actuations through the actuation of out-of-plane movable plates.
引用
收藏
页码：159 / 162
页数：4
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