Dielectric Waveguide Based Multi-Mode sub-THz Interconnect Channel for High Data-Rate High Bandwidth-Density Planar Chip-to-Chip Communications

This paper presents a dielectric waveguide based multimode subTHz interconnect channel for high datarate high bandwidthdensity planar chiptochip communications. By using a proposed new transition of microstrip line to dielectric waveguide, the interconnect channel achieves wide bandwidth on two orthogonal modes E-y11 and E-x11. To the authors' knowledge, this is the first demonstration of a multimode subTHz interconnect channel. The measured minimum insertion losses for mode E-y11 and mode Ex11 are 8.0 dB with 21.3 GHz 3dB bandwidth and 9.0 dB with 24.0 GHz 3dB bandwidth, respectively.