Study on growth mechanism of low-temperature prepared microcrystalline Si thin films

被引:7
|
作者
Gu, JH
Zhou, YQ [1 ]
Zhu, MF
Li, GH
Kun, D
Zhou, BQ
Liu, FZ
Liu, JL
Zhang, QF
机构
[1] Chinese Acad Sci, Grad Sch, Dept Phys, Beijing 100049, Peoples R China
[2] Chinese Acad Sci, Inst Semicond, Beijing 100093, Peoples R China
关键词
growth mechanism; microcrystalline silicon thin film; surface morphology; hot wire chemical vapor deposition;
D O I
10.7498/aps.54.1890
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Microcrystalline silicon thin films at different growth stages were prepared by hot wire chemical vapor deposition. Atomic force microscopy has been applied to investigate the evolution of surface topography of these films. According to the fractal analysis I it was found that, the growth of Si film deposited on glass substrate is the zero-diffused stochastic deposition; while for the film on Si substrate, it is the finite diffused deposition on the initial growth stage, and transforms to the zero-diffused stochastic deposition when the film thickness reaches a certain value. The film thickness dependence of island density shows that a maximum of island density appears at the critical film thickness for both substrates. The data of Raman spectra approve that, on the glass substrate, the a-Si: H/mu c-Si:H transition is related to the critical film thickness. Different substrate materials directly affect the surface diffusion ability of radicals, resulting in the difference of growth modes on the earlier growth stage.
引用
收藏
页码:1890 / 1894
页数:5
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