Highly reliable gate oxide under Fowler-Nordheim electron injection by deuterium pyrogenic oxidation and deuterated poly-Si deposition

被引:13
|
作者
Mitani, Y [1 ]
Satake, H [1 ]
Itoh, H [1 ]
Toriumi, A [1 ]
机构
[1] Toshiba Corp, Adv LSI Technol Lab, Isogo Ku, Yokohama, Kanagawa 2358522, Japan
关键词
D O I
10.1109/IEDM.2000.904326
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on the realization of highly reliable deuterated oxide by deuterium pyrogenic oxidation and poly-Si deposition using deuterated monosilane gas (SiD4). The properties of these deuterated oxides are compared with those of deuterium-annealed oxide. It is concluded that the improvement of the gate oxide reliability by a deuterium incorporation is dependent on the method whereby deuterium is incorporated into gate oxide film and that deuterium atoms, which is incorporated into both Si/SiO2 interface and bulk-SiO2 by the oxidation and poly-Si deposition, play an important role in the suppression of electron trap creation under Fowler-Nordheim (F-N) stress.
引用
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页码:343 / 346
页数:4
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