Preparation of polymer brush/Ni particle and its application in electroless copper plating on PA12 powder

Electroless plating on Nylon 12 (PA12) powder is a low-cost process for surface metallization, but, noble metal activation and complex production make it difficult to practical use. We employ a method combined with 3-amino-propyltriethoxysilane (KH550) modification, Ni activation and electroless plating to fabricate Cu-plated PA12 powder. The Ni-adsorbed and activated mechanism were also investigated systematically. Results showed amine group attached on KH550-modified PA12 powder, which could chemisorb Ni particle. As a result, these is polymer brush/Ni particle structure on the PA12 surface, which can realize to modify Ni outermost electron and catalyze electroless copper plating. Spherical Cu and cubic Cu2O particles deposited on PA12 surface due to lower ENi2+/Ni\* MERGEFORMAT, higher Ni catalytic ability and weak [Cu-C6H5O7](-) complex. The Cu2O crystal with a length of about 1 mu m display systematically varying degrees of the 8-pod branching growth. Our results provide the underlying insights needed to guide the design of the fabrication of metal polymer.