Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains

被引：20

作者：

Liao, Wen-Kai ^{[1
]}

Chen, Chih-Ming ^{[1
]}

Lin, Ming-Tzer ^{[2
]}

Wang, Chao-Hong ^{[3
]}

机构：

[1] Natl Chung Hsing Univ, Dept Chem Engn, Taichung 402, Taiwan

[2] Natl Chung Hsing Univ, Inst Precis Engn, Taichung 402, Taiwan

[3] Natl Chung Cheng Univ, Dept Chem Engn, Chiayi 621, Taiwan

来源：

SCRIPTA MATERIALIA | 2011年 / 65卷 / 08期

关键词：

Intermetallic compounds; Nickel; Grain growth; Strain; NI; SN; SOLDER; TEMPERATURE; DIFFUSION; METALLIZATION; THICKNESS;

D O I：

10.1016/j.scriptamat.2011.07.007

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A Sn/Ni bilayer deposited on a Si substrate is subjected to tensile or compressive strain under three-point bending to investigate the Sn/Ni interfacial reactions under strain. Both tensile and compressive strains are found to have enhanced effects on the growth of the Ni3Sn4 phase which formed at the Sn/Ni interface when it was aged at 200 degrees C. When subjected to strains, the Ni layer exhibits significant microstructure evolution, which is suggested to play a crucial role in the enhanced growth of the Ni3Sn4 phase. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：691 / 694

页数：4

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