Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package

被引：0
|
作者：
Pang, HLJ [1 ]
Toh, KC [1 ]
Tan, CK [1 ]
Tan, TL [1 ]
Leonard, JF [1 ]
Chen, YS [1 ]
机构：
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
来源：
PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE | 1997年
关键词：
D O I：
10.1109/EPTC.1997.723889
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：75 / 81
页数：7
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