Approximate solutions of grain boundary diffusion in thin films in the B2 regime

被引：0

作者：

Fielitz, P ^{[1
]}

Borchardt, G ^{[1
]}

机构：

[1] Tech Univ Clausthal, Inst Met, D-38678 Clausthal Zellerfeld, Germany

来源：

DIFFUSION IN MATERIALS: DIMAT 2004, PTS 1 AND 2 | 2005年 / 237-240卷

关键词：

grain boundary diffusion; approximate solutions; thin film; B(2) regime;

D O I：

10.4028/www.scientific.net/DDF.237-240.206

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Exact mathematical solutions of the grain boundary diffusion equation in thin films have generally a complicated form, which is too cumbersome for the evaluation of experimental average concentration depth profiles obtained by sectioning techniques. On the other hand the accuracy of the exact solutions is not necessary for practical purposes so that it is useful to derive sufficiently accurate approximate solutions. We propose a method to derive such solutions for a thin film if the grain boundary diffusion is in the B(2) regime. These solutions are derived for different diffusion sources.

引用

页码：206 / 211

页数：6

共 50 条

[1] Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime C
Ostrovsky, A.
Diffusion and Defect Data. Pt A Defect and Diffusion Forum, (156):
[2] Grain boundary diffusion in thin films under stress field in kinetic regime "C"
Ostrovsky, A
DEFECT AND DIFFUSION FORUM, 1998, 156 : 249 - 253
[3] Grain boundary diffusion and grain boundary structure in nanocrystalline thin films
Losch, W
Jardim, PM
SCRIPTA MATERIALIA, 1998, 38 (12) : 1857 - 1861
[4] Grain boundary diffusion in thin films with a bimodal grain boundary structure
Makovec, A.
Erdelyi, G.
Beke, D. L.
THIN SOLID FILMS, 2012, 520 (06) : 2362 - 2367
[5] Atomistic simulation of grain boundary structure and diffusion in B2 NiAl
Mishin, Y
Farkas, D
INTERFACIAL ENGINEERING FOR OPTIMIZED PROPERTIES, 1997, 458 : 21 - 26
[6] A note on grain boundary diffusion in thin films
Wang, WL
Chou, YT
Lee, S
SCRIPTA MATERIALIA, 1999, 41 (10) : 1061 - 1065
[7] Constrained grain boundary diffusion in thin copper films
Buehler, MJ
Hartmaier, A
Gao, HJ
NANOSCALE MATERIALS AND MODELING-RELATIONS AMONG PROCESSING, MICROSTRUCTURE AND MECHANICAL PROPERTIES, 2004, 821 : 221 - 232
[8] Stresses effect on grain boundary diffusion in thin films
Balandina, N
Bokstein, B
Peteline, A
Ostrovsky, A
DIFFUSION AND STRESSES, 1996, 129 : 151 - 162
[9] Effect of atomic interaction on grain boundary diffusion in the B regime
Esin, Vladimir A.
Bokstein, Boris S.
ACTA MATERIALIA, 2012, 60 (13-14) : 5109 - 5116
[10] Grain boundary reactive diffusion in Ni2Si thin films
Losch, W
Acchar, W
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1999, 173 (01): : 275 - 279

← 1 2 3 4 5 →