System demonstrator for board-to-board level substrate-guided wave optoelectronic interconnections

被引：0
|
作者：
Han, XL [1 ]
Kim, G [1 ]
Gupta, H [1 ]
Lipovski, GJ [1 ]
Chen, RT [1 ]
机构：
[1] Univ Texas, Dept Elect & Comp Engn, Microelect Res Ctr, Austin, TX 78712 USA
来源：
OPTOELECTRONIC INTERCONNECTS VIII | 2001年 / 4292卷
关键词：
substrate-guided wave; optoelectronic interconnections; centralized optical backplane;
D O I：
10.1117/12.428023
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We design and implement a system demonstrator based on vertical-cavity surface-emitting lasers, polymeric hologram grating couplers, and metal-semiconductor-metal photodetectors. As a preliminary experiment, we show the feasibility of board-to-board level substrate-guided wave optoelectronic interconnections in the real electrical system. First, we introduce a new architecture - centralized optical backplane - for board-to-board level interconnections. Second, the optoelectronic data channel is constructed compatible with standard PECL and capable of operating at 1.25 Gbps. Finally, it is employed to replace the conventional electrical data channel in a microprocessor system. We describe the performance of the entire system and discuss the future application of our centralized optical backplane in other electrical systems.
引用
收藏
页码：131 / 140
页数：10
相关论文
共 50 条
  • [1] Modeling board-to-board interconnections
    Gailus, M
    Fusi, MA
    Zanella, F
    CONNECTOR SPECIFIER, 1996, 12 (05): : 16 - 17
  • [2] Hybrid free-space optical bus system for board-to-board interconnections
    Appl Opt, 32 (6354):
  • [3] Hybrid free-space optical bus system for board-to-board interconnections
    Yeh, JH
    Kostuk, RK
    Tu, KY
    APPLIED OPTICS, 1996, 35 (32): : 6354 - 6364
  • [4] Modeling of Electromagnetic Interference Shielding Materials in Wireless Power Transfer for Board-to-Board Level Interconnections
    Kim, Sukjin
    Jung, Daniel H.
    Kim, Jonghoon J.
    Bae, Bumhee
    Kong, Sunkyu
    Song, Chiuk
    Kim, Joungho
    2014 IEEE WIRELESS POWER TRANSFER CONFERENCE (WPTC), 2014, : 273 - 276
  • [5] Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems
    Bosman, E.
    Van Hoe, B.
    Missinne, J.
    Van Steenberge, G.
    OPTICAL INTERCONNECTS XIV, 2014, 8991
  • [6] Fully embedded board-level guided-wave optoelectronic interconnects
    Chen, RT
    Lin, L
    Choi, C
    Liu, YJJ
    Bihari, B
    Wu, L
    Tang, SN
    Wickman, R
    Picor, B
    Hibbs-Brenner, MK
    Bristow, J
    Liu, YS
    PROCEEDINGS OF THE IEEE, 2000, 88 (06) : 780 - 793
  • [7] Centralized optical backplane with energy equalized fan-outs for board-to-board interconnections
    Kim, G
    Han, XL
    Chen, RT
    OPTOELECTRONIC INTERCONNECTS VIII, 2001, 4292 : 42 - 51
  • [8] DESIGN AND PERFORMANCE OF A MULTIPROCESSOR SYSTEM EMPLOYING BOARD-TO-BOARD FREE-SPACE OPTICAL INTERCONNECTIONS - COSINE-1
    SAKANO, T
    MATSUMOTO, T
    NOGUCHI, K
    SAWABE, T
    APPLIED OPTICS, 1991, 30 (17) : 2334 - 2343
  • [9] Free-space holographic optical interconnects for board-to-board and chip-to-chip interconnections
    Yeh, JH
    Kostuk, RK
    OPTICS LETTERS, 1996, 21 (16) : 1274 - 1276
  • [10] Board-to-board optical interconnection system using optical slots
    Cho, IK
    Yoon, KB
    Ahn, SH
    Jeong, MY
    Sung, HK
    Lee, BH
    Heo, YU
    Park, HH
    IEEE PHOTONICS TECHNOLOGY LETTERS, 2004, 16 (07) : 1754 - 1756
12345