Special issue on interfacial reactions, solid state transformations and thermal management - Foreword

被引：0

作者：

Ghosh, G ^{[1
]}

Kang, S

Murty, KL

Notis, M

机构：

[1] Northwestern Univ, Evanston, IL 60208 USA

[2] IBM Corp, Armonk, NY 10504 USA

[3] N Carolina State Univ, Raleigh, NC 27695 USA

[4] Lehigh Univ, Bethlehem, PA 18015 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1998年 / 27卷 / 11期

关键词：

D O I：

10.1007/s11664-998-0061-z

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1137 / 1137

页数：1

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