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- [1] A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding Microsystem Technologies, 2018, 24 : 815 - 822
- [2] A thermodynamic study of voiding phenomena in Cu-Cu thermo-compression wafer bonding MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 815 - 822
- [3] Study on thermo-compression bonding with non-conductive paste process technology and reliability of flip chip<bold> </bold> 2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
- [4] A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-compression Bonding Method 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 2168 - 2174