A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers

A novel CMOS-compatible technology for the fabrication of MEMS based on standard single crystal silicon wafers is available at the Center of Microtechnologies [1]. High Aspect Ratio Microstructures (HARMs) are manufactured using a three mask level technology and dry processing throughout. The released micromechanical components consist of monocrystalline silicon without additional thin films after processing. As a result of the novel process flow the structures are surrounded by air gaps and fixed by special anchors. These Air gap Insulated Microstructures (AIM) were fabricated and tested with respect to mechanical stability, temperature dependence and electrical behavior. The low production costs and high device performance of the fabricated sensors and actuators demonstrate the ability of the technology for high volume production.