Predictive Modelling Methodologies for Bi-Material Wafer Warpage

被引：0

作者：

Ong, Kang Eu ^{[1
]}

Loh, Wei Keat ^{[1
]}

Wang, Jenn An ^{[2
]}

Purushotaman, Arvind ^{[3
]}

Yoshida, Tatsuro ^{[4
]}

Murayama, Kei ^{[4
]}

Tsukahara, Makoto ^{[4
]}

Kulterman, Ron W. ^{[5
]}

Fu, Haley ^{[6
]}

机构：

[1] Intel Technol Sdn Bhd, Bayan Lepas, Malaysia

[2] CoreTech Syst Moldex3D, Zhubei City, Taiwan

[3] ANSYS, New York, NY USA

[4] Shinko Elect Ind Co Ltd, Tokyo, Japan

[5] Flex Ltd, Austin, TX USA

[6] iNEMI, Shanghai, Peoples R China

来源：

2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021) | 2021年

关键词：

wafer warpage; bi-material; curing kinetics; warpage modeling; visco-elasticity; PVTC;

D O I：

10.23919/ICEP51988.2021.9451946

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Wafer warpage modeling is challenging for semiconductor industry because simulation tools need to consider multi-physics behavior and non-linear material properties. This paper conducted a wafer warpage experiment and simulation on bi-material wafer which consists of silicon and substrate's polymer materials. In the experiment, the bimaterial wafer was thermally cured along a temperature profile with warpage measurement. For modelling study, pressure-volume-temperature-cure (PVTC) effect and visco-elastic (VE) with time-temperature shift factor (TTS) were considered in the polymer material model. The simulation results were compared with the experiment data.

引用

页码：45 / 46

页数：2

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