On liftings of holomorphic modular forms

被引:0
|
作者
Ikeda, Tamotsu [1 ]
机构
[1] Kyoto Univ, Grad Sch Math, Kyoto 6068502, Japan
关键词
Siegel modular forms; hermitian modular forms; Eisenstein series; lifting of cusp forms;
D O I
暂无
中图分类号
O1 [数学];
学科分类号
0701 ; 070101 ;
摘要
In this article, we discuss a lifting of elliptic cusp forms to higher dimensional symmetric spaces. We will consider two cases. The first case is the Siegel modular case, and the second case is the hermitian modular case. The Fourier coefficients of our liftings are closely related to those of Eisenstein series. When the degree is 2, our lifting reduces to the classical Saito-Kurokawa lifting or hermitian Maass lifting.
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页码:29 / 44
页数:16
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