Diffusion barrier property of sputtered molybdenum nitride films for DRAM copper metallization

被引：0
|
作者：
Park, JW [1 ]
Lee, JY [1 ]
机构：
[1] HANYANG UNIV,DEPT ENGN MET,SEOUL 133791,SOUTH KOREA
来源：
POLYCRYSTALLINE THIN FILMS: STRUCTURE, TEXTURE, PROPERTIES, AND APPLICATIONS II | 1996年 / 403卷
关键词：
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：687 / 692
页数：6
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