REDUCING THE COST OF APPLYING ULTRA-THIN, PACKAGE LEVEL EMI SHIELD COATINGS

被引：0
|
作者：
Erickson, Stuart [1 ]
机构：
[1] Ultrason Syst Inc, Haverhill, MA 01835 USA
来源：
2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC) | 2018年
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D O I：
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页数：4
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