Numerical analysis of a slurry flow on a rotating CMP pad using a two-phase flow model

被引：0

作者：

Nagayama, Katsuya ^{[1
]}

Sakai, Tommi ^{[2
]}

Kimura, Keiichi ^{[1
]}

Tanaka, Kazuhiro ^{[1
]}

机构：

[1] Kyushu Inst Technol, Dept Mech Informat Sci & Technol, Iizuka, Fukuoka 8208502, Japan

[2] Kyushu Inst Technol, Grad Sch Mech Informat Syst, Iizuka, Fukuoka 8208502, Japan

来源：

INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING | 2008年 / 9卷 / 02期

关键词：

CMP; wafer; pad; slurry; numerical simulation;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a slurry-coated pad. A slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad This research aims at reducing the slurry consumption and removing waste particles quickly from the wafer. To study the roles of grooves, slurry flows were simulated using the volume of fluid method (two-phase model for air and slurry) for pads with no grooves, and for pads with circular grooves.

引用

页码：8 / 10

页数：3

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