A highly integrated T/R module for active phased array antennas

被引：3
|
作者：
Fujii, K [1 ]
Hara, Y [1 ]
Shibuya, Y [1 ]
Sakai, T [1 ]
Takano, Y [1 ]
机构：
[1] Japan Radio Co Ltd, Mitaka, Tokyo 1818510, Japan
来源：
1998 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM | 1998年
关键词：
D O I：
10.1109/RFIC.1998.682052
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A highly integrated transmit/receive (T/R) module that has achieved integration levels superior to any MMIC module will be described. Highly integrated T/R module is achieved by using LTCC(Low Temperature Go-fired Ceramic) multiple layer substrate, highly integrated MMIC chip-set, large-signal simulation for switching MESFET circuits, high power and high efficiency amplifiers using a PHEMT process, multiple-cavity package, advanced thin-film substrate which enables to realize air bridge structures, and self align like void free MMIC die-bonding technique.
引用
收藏
页码：77 / 80
页数：4
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